JPH0392046U - - Google Patents
Info
- Publication number
- JPH0392046U JPH0392046U JP15085389U JP15085389U JPH0392046U JP H0392046 U JPH0392046 U JP H0392046U JP 15085389 U JP15085389 U JP 15085389U JP 15085389 U JP15085389 U JP 15085389U JP H0392046 U JPH0392046 U JP H0392046U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- chip
- bonding pad
- chip component
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15085389U JPH0392046U (en]) | 1989-12-30 | 1989-12-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15085389U JPH0392046U (en]) | 1989-12-30 | 1989-12-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0392046U true JPH0392046U (en]) | 1991-09-19 |
Family
ID=31697185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15085389U Pending JPH0392046U (en]) | 1989-12-30 | 1989-12-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0392046U (en]) |
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1989
- 1989-12-30 JP JP15085389U patent/JPH0392046U/ja active Pending